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GY-85 Sensor Module 9 Axis 6DOF 9DOF IMU Sensor

$11.95

GY-85 Sensor Module
GY-85 Sensor Module
GY-85 Sensor Module
GY-85 Sensor Module

GY-85 Sensor Module 9 Axis 6DOF 9DOF IMU Sensor

$11.95

1 in stock

SKU: GY85. Category: . Tags: , , .

GY-85 Sensor Module Features

  • Nine-axis module (three-axis gyroscope + triaxial accelerometer + three-axis magnetic field)
  • Chip: ITG3205 + ADXL345 + HMC5883L
  • Power supply :3-5V
  • Communication : I2C communication protocol

Datasheets

 

GY-85 Sensor Module Application Software Download

Honeywell HMC5883L

The Honeywell HMC5883L is a surface-mount, multi-chip module designed for low-field magnetic sensing with a digital interface for applications such as lowcost compassing and magnetometry. The HMC5883L includes our state-of-theart, high-resolution HMC118X series magneto-resistive sensors plus an ASIC containing amplification, automatic degaussing strap drivers, offset cancellation, and a 12-bit ADC that enables 1° to 2° compass heading accuracy. The I 2C serial bus allows for easy interface. The HMC5883L is a 3.0×3.0x0.9mm surface mount 16-pin leadless chip carrier (LCC). Applications for the HMC5883L include Mobile Phones, Netbooks, Consumer Electronics, Auto Navigation Systems, and Personal Navigation Devices.

The HMC5883L utilizes Honeywell’s Anisotropic Magnetoresistive (AMR) technology that provides advantages over other magnetic sensor technologies. These anisotropic, directional sensors feature precision in-axis sensitivity and linearity. These sensors’ solid-state construction with very low cross-axis sensitivity is designed to measure both the direction and the magnitude of Earth’s magnetic fields, from milli-gauss to 8 gauss. Honeywell’s Magnetic Sensors are among the most sensitive and reliable low-field sensors in the industry.

Analog Devices ADSL345

The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface.

The ADXL345 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°.

Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction.

Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption.

Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, plastic package.

InvenSense ITG-3200

The ITG-3200 is the world’s first single-chip, digital-output, 3-axis MEMS gyro IC optimized for gaming, 3D mice, and 3D remote control applications. The part features enhanced bias and sensitivity temperature stability, reducing the need for user calibration. Low frequency noise is lower than previous generation devices, simplifying application development and making for more-responsive remote controls.

The ITG-3200 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyro outputs, a user-selectable internal low-pass filter bandwidth, and a Fast-Mode I2C (400kHz) interface. Additional features include an embedded temperature sensor and a 2% accurate internal oscillator. This breakthrough in gyroscope technology provides a dramatic 67% package size reduction, delivers a 50% power reduction, and has inherent cost advantages compared to competing multi-chip gyro solutions.

By leveraging its patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the ITG-3200 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic devices. The part features a robust 10,000g shock tolerance, as required by portable consumer equipment.

For power supply flexibility, the ITG-3200 has a separate VLOGIC reference pin, in addition to its analog supply pin, VDD, which sets the logic levels of its I2C interface. The VLOGIC voltage may be anywhere from 1.71V min to VDD max.

Weight .1 lbs
Dimensions .3 x .3 in

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